Kestopur 205/8
2-component solvent-free pu-adhesive
Kestopur 205/8 is a 2-component polyurethane adhesive for the gluing of metal, wood and insulation materials, as well as fiber composites in sandwich panel constructions for the transportation industry.
Special features
- Solvent-free
- Strong, durable
- Suitable for automatic application
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Materials
Kestopur 205/8 gives a strong, yet an elastic bond. Ideal for automatic application. Special characteristics of the adhesive is its ductile adhesion on metal surfaces. Suitable for e.g. gluing of metals, wood, insulation materials and fiber composite. Used in conjunction with Kestopur 200/S -hardener. Adhesive is compliant with Finnish Emission Classification of Building Materials (M1).
Package Size | Product Code |
---|---|
Kestopur 205/8 Schütz cont | T3397.996 |
Kestopur 205/8 kontti | T3397.992 |
30 %
Polyurethane
Resin: 1,6 g/cm³, Hardener: 1.2 g/cm³
SS-SS 9 N/mm², Al ≥ 5 N/mm² (28 d 23 °C, 50 % RH)
7 N/mm² (DIN 53504)
25 % (DIN 53504)
Shore D 50
5 weight part Kestopur 205/8 resin + 1 weight part Kestopur 200/S hardener
Resin: approx. 15,000 mPas, Hardener: approx. 250 mPas (Brookfield RVT +20 °C)
approx. 7000 mPas (Brookfield RVT +20 °C)
approx. 8 min. (120 g, 20°C, 50 % RH)
max. 13 min (23 °C, RH 50 %)
150–500 g/m² depending on materials
min. 40 min / 20 °C
Unopened at +10–25 °C in a container (1000 l) for 6 months, in smaller containers 12 months. After long storing, stir before use.
The surfaces to be bonded must be clean and dry. Remove oxides by sanding, and grease etc. dirt with Kiilto Cleaner 303. The properly cleaned surface can be sanded and then primed to improve adhesion. Remove the sanding dust carefully prior to adhesive application. Stir Kestopur 205/8 resin before use. Add Kestopur 200/S hardener to resin and mix until a uniform colour is achieved. Apply the adhesive on one or both sides of the materials to be bonded. Fresh adhesive stains are removed with a dry cloth and then surfaces are cleaned with Kiilto Cleaner 303 or Kiilto Cleaner 302. Cured adhesive can be removed only by mechanically means. We recommend gluing at room temperature. The open time of the adhesive depends on temperature and air humidity. However, the gluing can be carried out at lower temperatures (even at +10 °C), but then the pressing time will be significantly longer and spreading properties will suffer. Higher pressing temperature will shorten the pressing time.
The information given in this product data sheet is based on our tests and our practical knowledge. The technical data is defined in standard conditions. Variations in local working conditions and methods will affect the product performance and result. The result is strongly affected by working methods. We guarantee the high quality of our products according to our Quality Management System. No liability can be accepted from incorrect use of the product or prevailing conditions, over which we have no control. Thus, we cannot be held responsible for the final result. The user of the product must test the product’s suitability for the intended application.
Avoid unnecessary skin contact with and exposure to the uncured product: use safety gloves. Refer to the specific material safety data sheet. Go to www.kiilto.com for more information on product and package disposal.